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• Fanless and compact design
• Intel® Atom™ E3845 1.91GHz SoC CPU
• Wide Temperature Support: -40~70ºC
• With 2 x GbE SFP Fiber
• ESD/surge protection on serial COM ports for harsh environments
• 5 x GbE LAN with 1 pair Gen.3 LAN bypass
• DIN rail or wall mounting options
• 1 x USB 3.0 and 1x USB 2.0 port plus internal USB pin-header

• IEC 61850-3 and IEEE 1613 Certified
• Support Intel® Xeon® W-11000 series CPU (Tiger Lake H)
• Support 2x SO-DIMM DDR4 ECC memory up to 64GB
• 4x 2.5GbE RJ45, 1x PCIe x16, 3x PCIe x4
• 5x USB, 2x HDMI, 2x isolated COM ports
• 2 or 3x 2.5”swappable drive bays (by SKU)
• Support dual power input
• Wide temperature range -40°C~70°C

• Wide operating temperature range (-40~70°C)
• Intel® Atom™ E3825 SoC CPU
• Front access I/O ports: LEC-3031-A4/6/8: 4/6/8 x RS-232/422/485, LEC-3031-I4/10: 4 or 10 x isolated COM ports
• 2 or 4 x Isolated GbE LAN / 4 x USB:1x USB 3.0, 1x or 3x USB 2.0, VGA port
• 1 x M.2 3042 (USB2.0 signal) for 4G LTE Wireless Expansion
• Fanless and compact design

• Compact-sized industrial grade box PC
• Dual-core Intel Celeron N2807 SoC CPU or Single-core Atom E3815
• ESD/surge protection on serial COM ports for harsh environments
• Wide operating temperature (LEC-3030T:-40~70°C)
• Fanless design with corrugated aluminum
• Support VGA display output
• DIN-Rail or wall mounting options
• Support 4x DI/O
• Dual GbE LAN ports, 1 x USB 2.0, 1 x USB 3.0 port
• 1 x SATA port

• Intel® Core™ i7-6600U/i5-6300U/i3-6100U
• Intel® HD Graphics
• 2x HDMI, 3840 x 2160@24Hz or 2560 x 1600@60Hz
• 6x RJ45 (LEC-2580) or 2x RJ45 & 4x PoE (LEC-2580P)
• 4x USB 3.0, 2x USB 2.0
• 2x 2.5” HDD/SSD with RAID 0/1, 4x Serial Ports
• Operating Temperatures: 0°C~60°C (LEC-2580), 0°C~50°C (LEC-2580P)

• Intel® Celeron® J1900 processor
• Fanless design
• 2 Giga LAN ports
• 2 serial COM ports
• 5 USB ports
• Mini-PCIe, PCI and PCI-E riser cards
• 9VDC to 30VDC power input

• Intel® Core™ i7 Processor (Coffee Lake)
• Built-in SiMa.ai’s MLSoC™
• 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
• 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
• 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
• Built-in TPM 2.0 & Optional IPMI Support

• Intel® Core™ i7 Processor (Coffee Lake)
• NVIDIA® L4 GPU Card Support
• 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
• 2x RJ45 GbE, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DIO
• 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
• 1x PCIe*16, 1x Mini-PCIe w/ Nano-SIM, 1x B-Key M.2 w/ Nano-SIM
• Built-in TPM 2.0 & IPMI (optional) Support

NVIDIA L4

• Intel® Core™ i7 Processor (Coffee Lake)
• Falcon-H8 AI Accelerator Card With 6x Hailo-8™ AI Processors
• 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
• 2x GbE RJ45, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
• 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
• 1x PCIe*16, 1x Mini-PCIe (PCIe + USB2.0) w/ Nano-SIM, 1x B Key M.2 (PCIe + USB3.0) w/ Nano-SIM

• Intel® Core™ i7-9700TE
• 2x DDR4 2133/2400 SO-DIMM, Max.64GB
• 2x GbE RJ45 & 4x GbE PoE
• 4x USB3.0, 6x COM, 8x DIO, Audio
• 1x Mini-PCIe (PCIe + USB2.0) w/ Nano-SIM, 1x PCIe*16, 1x M.2 B-Key (PCIe + USB3.0) w/ Nano-SIM
• 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
• Wide temperature range of 0°C~40°C
• TPM 2.0 & IPMI Support (By Request)

• Intel® Core™ i7-8700T/i7-8700/i7-9700TE & Intel® Xeon® E-2278GEL
• 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
• 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
• 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
• 1x PCIe*16,1x Mini-PCIe w/ Nano-SIM, 1x B Key M.2 w/ Nano-SIM

• Intel® Celeron® N3350 or Atom™ x7-E3950
• 6x Ethernet Ports (LEC-2137A/LEC-2137C)
• 2x Ethernet Ports & 4x PoE Ports (LEC-2137B/LEC-2137D)
• 2x USB 3.0, 2x USB 2.0, 1x RS-232/422/485 DB9 Male
• -20°C~55°C Operating Temperatures (LEC-2137A/LEC-2137B)
• 1x HDMI (3840 x 2160), 1x VGA (1600 x 1200)

• Intel® Atom™ x6425E Processor (Elkhart Lake)
• 1x DDR4 3200MT/s SODIMM slot up to 32GB with In Band ECC
• 3x Removable PGN Series Caddy, 1x M.2 3042 B-Key socket with dual nano-SIM slot for 4G LTE, 1x M.2 2230 E-Key socket for WiFi
• 2x GbE RJ45, 3x USB 2.0, 1x USB 3.0, 2x HDMI, 1x TPM 2.0 2x RS232/422/485, 1x CAN 2.0, 4x DIO isolation
• eMMC 64GB up to 128GB storage, 1x SATA
• Operating temperature: -40~70ºC

• Fanless Design Compliant with IP67 and MIL-STD-810G
• Intel® Atom® C3000 Extended Temperature CPU (Denverton)
• 2x DDR4 up to 2133 MHz ECC SODIMM Slots, Default 16GB x1
• M12 I/O: SR-IOV for 4x LAN, 2x PoE+(By SKU), 1x USB, 1x Console
• Wide Operating Temperature: -40~70ºC or -40~60ºC (By SKU)
• 1x M.2 Socket for 5G, 1x M.2 socket for Wi-Fi 6, 1x Mini-SIM
• Intel® QuickAssist Technology
• On-board eMMC 128GB, 1x M.2 2242 B Key, TPM 2.0

• 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
• 2x DDR4 3200 IBECC SO-DIMM, Max. 64GB
• 4x PoE+, 2x Ethernet Ports, 4x COM Ports (option for 2x CAN 2.0A/B), 4x USB 3.0
• Intel® Iris® Xe Graphics, 2x HDMI, 4x DI & 4x DO
• 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi, 1x mSATA

• 11th Gen Intel® Core™ i CPU (Up to i7-1185GRE)
• 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
• Hailo-8™ M.2 Module Pre-installed
• 2x 2.5Gbps RJ45, 6x GbE RJ45 For PoE+
• 2x COM Ports, 4x USB 3.0, 2x HDMI, 8x DI & 4x DO
• 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6, 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD
• Wide temperature range of -40°C~55°C

• 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
• 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
• 6x PoE+, 2x 2.5 Gbps RJ45, 2x COM Ports, 4x USB 3.0
• Intel® Iris® Xe Graphics, 2x HDMI, 8x DI & 4x DO
• 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6
• 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD

• Intel® Atom™ X7-E3950 / N3350 SoC CPU (formerly Apollo Lake)
• 2x COM, 2x CAN 2.0 (optional for 2x COM), 4x DI/DO, 2x USB 3.0, 1x DB9 console, DP, SKU A/M/O: 4x GbE RJ45 (one pair Bypass), SKU B/N/P: 2x GbE RJ45 (one pair Bypass) & 2x SFP, SKU Q: 4x GbE RJ45
• Onboard eMMC 64GB, DDR3L 4GB pre-install, 1x mSATA, optional 1x internal SATA 2.5” drive bay, TPM 2.0
• 1x M.2 B-Key w/ Nano SIM For LTE, 1x M.2 E-Key For Wi-Fi 5/6
• Wide operating temperature range: -40~70°C for industrial SKU A/B

• Intel® Apollo Lake CPU
• 3x or 2x GbE LAN, 2x RS232/422/485 COM
• 2x USB 3.0 & 2x USB 2.0, 2x Display Ports, 4x DIO
• 1x M.2 3042 B Key For LTE w/ Dual SIM, 1x M.2 2230 E Key For WiFi
• 1x mSATA, 1x 2.5” SATA Drive Bay (Optional)
• 1x DDR3L SODIMM, Max. 8GB

• 2x HSR/PRP/Ethernet ports+, 1x Ethernet port
• 1x PPS output (MMCA Interface)
• 1x PCIe (Full height / low profile slot)
• IEEE802.1d (STP), IEEE802.1w (RSTP), IEEE802.1s (MSTP)
• Time bridging between synchronization protocol
• Network Time Protocol (NTP) support

• Intel® Atom™ x7-E3950 Processor
• Certified with EN50155, EN50121, EN50125 and EN45545
• Vehicle/Rail Computer with 6x M12 GbE ports
• 2x M.2 Slots with up to 4x SIM card readers
• Wide range operating temperature from -40 to 70°C
• 2x HDMI and 4x USB ports
• 1x Internal HDD/SSD drive bay
• Support 24~36V or 72~110V power input

• IEC 61850-3 & IEEE 1613 certified
• AMD Ryzen V1404I
• 6x GbE RJ45 or 4x GbE RJ45 + 2x GbE SFP (1 pair LAN bypass by RJ45)
• 1x RJ45 Console, 1x USB 3.0, 2x DIO
• 1x M.2 3042 B-Key for LTE module with dual Nano-SIM
• Dual +12~48VDC Power Input
• Wide Operating Temperature -40~70ºC

• IEC 61850-3 and IEEE 1613 Certified
• Certified with IP30 rating for enhanced durability
• Intel® Atom™ X6211E/X6413E/X6425E CPU (Elkhart Lake)
• 6x 100M/1G/2.5 GbE RJ45 with 1 pair bypass, 2x GbE SFP, TPM 2.0, 1x COM, 2x USB, 2x DIO
• Chassis Intrusion Detection, TPM 2.0, Optional IPMI support
• 1x M.2 B-Key For LTE/5G, 1x M.2 E-Key for Wi-Fi module
• Dual +12~48Vdc Power Input, Operating Temperature -40~70ºC

• Industrial Grade Cyber Security Platform
• Intel® Atom™ x7-E3950/x5-E3940 (Apollo Lake)
• 8x, 6x or 4x GbE RJ45 ports with 1 or 2 pairs Bypass, SKU C,D,F with 2x GbE SFP
• 2x USB 3.0, 1x DB9 console, 2x DIO, 64GB eMMC onboard
• 1x M.2 B-Key for LTE/5G sub6 with dual SIM, 1x M.2 E-Key for WiFi
• Supports UL, C1D2 Compliant (by SKU)
• Onboard TPM 2.0

• Intel® Xeon® 6 SoC Processor (Codenamed Granite Rapids D)
• 2CH ECC DDR5, Memory Down, 4800MT/s, Max 32GB
• 1x GbE RJ45 & 2x 100G QSFP56
• 1x Mini USB Console, 1x USB Type C
• 128GB NVME (PCIE*2) Onboard Storage, Onboard TPM

• OPMA Interface and IPMI 2.0 Compliant
• Centralized Management and Remote Configuration
• Branding Service
• Support TLS 1.3 over HTTPS

• OPMA Interface and IPMI 2.0 Compliant
• Centralized Management and Remote Configuration
• Branding Service
• Support TLS 1.3 over HTTPS

• Carrier-grade, full redundancy and extreme high performance
• 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
• Support 5x 1U compute sleds or 2x 2U+1U compute sleds
• Support 2x 1U switch sleds for redundancy
• Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe by 16 card
• 450mm Short Depth Chassis for Edge Deployment
• Distinguished, Flexible and Front I/O Access
• 1+1 Redundant Hot-swappable PSU
• NEBS-3 Compliant for Harsh Conditions

Available Blades

• High availability, full redundancy and extreme high performance
• 6 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
• 6 x Swappable I/O blades on the front, supporting up to 2x Switch blades or 6x Ethernet blades; 6x swappable 3.5” HDD bays
• Blade 1~2: Switch fabric blade or Blade 1~6: Ethernet I/O blade
• NEBS compliant design
• Redundant power supply and removable fan module

Available Blades

• High availability, full redundancy and extreme high performance
• 4 compute blades in the rear, per blade supports up to dual Intel® Xeon® Scalable (Skylake-SP) CPUs and 16x DDR4 R-DIMM
• Upper 2 slots: 2x switch blades in upper two slots for redundancy or 2x Ethernet blades
• Bottom 2 slots: Storage blades with 10x NVMe SSD in bottom two slots or up to 2x Ethernet blades
• Max. up to 80 ports 10G SFP+ Ethernet ports (4x Ethernet blades)
• N+N Redundant power supply and removable fan module
• NEBS compliant design

Available Blades

• High availability, full redundancy and extreme high performance
• 2 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
• Blade 1~2: Switch fabric blade or ethernet I/O blade
• 2 x Swappable I/O blades in front, supporting up to 2 switch blades or Ethernet blade configuration
• Redundant power supply and removable fan module
• NEBS compliant design

Available Blades

• Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
• Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
• Support FH3/4L double width or single width PCIe Card
• Support OCP NIC 3.0 Modules
• Compatible with HTCA-E400 Series

• Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
• Front Access I/O: Storage bays x2, PCIe x1, NIC slot x1, mini-DP port, LOM and USB 3.0 ports
• Support FHHL PCIe by 16 card
• Support OCP NIC 3.0 Modules
• Compatible with HTCA-E400 Series

PRELIMINARY

• Hot swappable x86 compute blade
• 4th Generation Intel® Xeon® Scalable Processors with Emmitsburg PCH
• DDR5 4800 MHz REG DIMM, 16x 288pin DIMM Socket, LRDIMM 1024GB (16 x 64GB) per M/B tray
• Built-in Intel QuickAssist Technology (QAT)
• 4x KR4 supporting 4x 100G to front Switch blades
• 5x Hot swappable smart fans

• Hot swappable x86 compute blade
• Support dual 2nd Generation Intel® Xeon® Scalable Processors (codenamed Skylake-SP/Cascade Lake) C621/C627 PCH
• 16x 288-pin DDR4 DIMMs, max. up to 512GB memory capacity
• 4x KR4 supporting 4x 100G to front Switch blades
• 5x Hot swappable smart fans

• Intel Atom SoC Processor E3800 Product Family
• DDR3 SODIMM Socket up to 8GB DDR3L Non-ECC Memory
• Use SAMTEC connector to connect HLM-1020

• Fabric interface with 6x 100GbE QSFP28, 8x 10/25GbE SFP+
• Intel Tofino Series (BFN-T10-032D-B0) the maximum bandwidth up to 3.2 Tb/s.
• Compatible with HTCA-E400 Series

• Fabric interface switch blade with 14x 100GbE QSFP28
• Intel Tofino T10-032D 3.2Tbps bandwidth Multilayer Switch
• P4 programmable
• Compatible with HTCA-6600 Series

• 2 x 100GbE QSFP28 + 16 x 10/25GbE SFP28 + 4 x 10GbE RJ45Switch Blade
• Broadcom StrataXGS Trident-III BCM 56770 switch controller
• Compatible with HTCA-6000 Series

• Intel XL710 Ethernet Controller
• 20-port 10GbE SFP+ cage
• Compatible with HTCA 6000 Series

• 1U Height Form Factor for HTCA Chassis
• Support 6x NVMe SSD Trays
• Maximum Capacity Support up to 3.2TB/18W NVMe SSD
• Hot Swappable
• Compatible with HTCA-6000 Series

• Fabric interface switch blade with 6x 100GbE QSFP28, 4x 40GbE QSFP+ and 16x 10GbE SFP+
• Broadcom StrataXGS Tomahawk BCM56960 3.2Tbps bandwidth Multilayer Switch
• Compatible with HTCA-6000 Series

• 2U High Performance Hyper-converged Appliance
• Support Dual 2nd Gen Intel® Xeon® Scalable SP processor family up to 205w and max. up to 24x DDR4 R-DIMM
• Front: 12 x 3.5”HDD SATA 6G (Default) , SAS/2 NVME (Optional)
• Rear: 2 x 2.5” SATA 6G
• Console, LOM port, MGT port, 2x USB 3.0 ports, RJ45, SFP+ ports
• 2x PCI-E*16 FH 10.5”L (Max. 266.7mm) + 1x PCI-E *8 HH/HL
• 1+1 redundant power supply
• A NVIDIA-Certified System for enterprise edge

• 2nd Gen Intel® Xeon® Processor Scalable Family with Intel® C621/C627 Chipset
• 4x 3.5” Swappable HDD, 1x mSATA Onboard Slot
• 10x 288pin, DDR4 2666 MHz REG DIMM, Max. 320GB
• 4x 10G SFP+ or 4x GbE RJ45 (By SKU), 4x NIC Module Slots
• 2x Consoles (RJ45 and Mini USB), 2x USB 3.0
• Intel® QuickAssist Technology (By SKU)

• Intel Dual-core Atom C2000 SoC CPU (codenamed "Rangeley")
• Optional rear PCIe expansion slot
• FW-7571A: Built-in 6 GbE LAN ports, FW-7571B:Built-in 4 GbE LAN ports
• Supports Intel QuickAssist Crypto Acceleration
• Supports up to 8 GB ECC DDR3 Memory
• Intel i210AT LAN controller
• 2 system cooling fans
• FW-7571A supports 3rd Generation LAN Bypass function, FW-7571B without LAN Bypass

• Intel® Atom™ processor C2358(dual-core), C2518(quad-core) or C2558(quad-core) (Codenamed “Rangeley”)
• Fanless design
• 4 or 6 x GbE RJ-45 LAN ports
• Built-in Intel QuickAssist crypto acceleration
• Intel AES-NI new instructions
• Support up to 8GB DDR3 memory
• Intel i210AT LAN controller
• Support 1 pair Gen.2 LAN Bypass (FW-7525A/C/D)
• Optional rack mounting kit support

• Support For 4, 5 Or 6 Hailo-8™ AI Processors
• Support For Up To 156 TOPS 8000FPS Of ResNet-50
• Support For Hailo-8 Software Development Tools
• High Performance And Power Efficiency

• Best-in-class Performance And Cost-efficiency
• Scalable, Supports 1, 2 Or 4 Hailo-8™ AI Processors
• High Power Efficiency, Low Power Consumption
• Commercial And Industrial Grade Support
• Enablement Software Package With Advanced Deep Learning Models And AI Reference Applications
• Hailo-8™ Software Development Tools Significantly Reduce Time To Market For AI Applications

• Intel® Xeon® 6 Processor (P-core and E-core)
• 8x DDR5 6400MHz RDIMM, Max. 1024GB System Memory
• 2x PCIe*16 FHFL, 1x PCIe*16 FHHL Or 1x PCIe*16 LP (By SKU)
• 1x GbE RJ45, 1x USB 3.0
• 2x M.2 NVMe (PCIe), 2x E1.S SSD
• 6x Smart Fans, 2x 1600W AC CRPS PSU
• NVIDIA-Certified System (For Industrial Edge)

• Intel® Xeon® 6 Processor (Sierra Forest-SP/Granite Rapids-SP)
• 8x DDR5 6400MHz RDIMM, Max. 1024GB System Memory
• 1x GbE RJ45, 1x RJ45 Console, 2x USB 3.0, 1x LOM (Via BMC), TPM 2.0
• 4x E1.S (Swappable), 4x FHFL (PCIe*16, Double Width, 600W), 1x FHHL (PCIe*16, Double Width, 150W), M.2 NVMe (PCIe) 2280/22110 M Key
• Intel® Quick Assist Technology

• 5th/4th Gen Intel® Xeon® Scalable Processors
• 16x DDR5 RDIMM, Max. 1024 GB System Memory
• Short Depth Chassis And Front I/O Design
• 2x FHFL PCIe*16 Slot, 2x LP And 1x OCP 3.0 NIC Slot
• 1x M.2 NVMe (PCIe) 2242/2260 M Key, 1x M.2 NVMe (PCIe) 2280 M Key
• Secure BMC / TPM 2.0

NVIDIA L4	NVIDIA L40S

• Intel® Xeon® 6 SoC (Codenamed Granite Rapids D)
• Intel® vRAN Boost Accelerator, Intel Media Transcode Accelerator Support
• 2x GbE RJ45 Ports, 8x 10G/25G SFP28 Ports, 2x 100G QSFP28 Ports
• Max. 512GB DDR5 6400MHz RDIMM
• 1x RJ45 Console Port, 2x USB 3.0 Ports
• 2x M.2 NVMe 22110/2280
• Support For IEEE 1588 PTP, SyncE And Integrated GNSS For High-precision Timing Sync
• -40~55ºC Operating Temperature Range
• Intel® QuickAssist Technology

• 4th/5th Gen Intel® Xeon® Scalable Processors
• Intel vRAN Boost Support (For 4th Gen Intel® Xeon® Scalable Processors Only)
• Ethernet Switch Integrated (Broadcom Hurricane3-MG) For 12x 10GbE SFP+
• Supports G.8272 T-GM Compliant IEEE 1588v2 SynE, Onboard GPS
• Short Depth Chassis and Front I/O Design
• 16x DDR5 4800MHz RDIMM, Max. 1024GB
• 0 ~ 40ºC Operating Temperatures
• 2x M.2 NVMe 2280
• 1xFHHL Slot (PCIe*8)
• Secure BMC / TPM 2.0

• 5th/4th Gen Intel® Xeon® Scalable Processors
• Intel vRAN Boost Support (For 4th Gen Intel® Xeon® Scalable Processors Only)
• Short Depth Chassis and Front I/O Design
• 16x DDR5 4800MHz RDIMM, Max. 1024GB
• 1x OCP 3.0 NIC Module
• 0 ~ 50ºC Operating Temperature (By CPU SKU)
• 2x M.2 NVMe 2280, 2x 2.5" HDD/SSD Or 2x U.2
• 1x FHFL PCIex 16 slot, 2xLP or 1xFHHL slot (PCIex8)
• Secure BMC / TPM 2.0
• A NVIDIA-Certified System for industrial edge

NVIDIA L4	NVIDIA L40S

• Intel® Xeon® D2798NT/D2786NTE/D2896TER/D2899NT
• 4x DDR4 3200/2933MHz REG RDIMM, Max. 256GB
• 8x 10G SFP+, 2x 25G SFP28, 2x GbE RJ45, 2x USB 3.0
• 1x RJ45 Console, 2x 2280 M.2 (1x NVMe & 1x SATA)
• 1x OCP 3.0, 1x PCIe*16
• NVIDIA-Certified System (For Industrial Edge)

NVIDIA L4	NVIDIA L40S

• Intel® Xeon D-2100 12/16 Cores Processor
• Wide Operating Temperature -40~65ºC
• 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
• Front Access I/O: 1x GbE RJ45 IPMI, 8x 10G SFP+, 2x 40G QSFP+, 1x RJ45 Console, 1x USB 3.0 and Front Fan Replacement
• 2x 2.5” Internal HDD/SSD Bays, 2x M.2 NVMe 2280 M key
• 1x PCI-E*16 FH/HL slot for FPGA or GPU cards
• Optional G.8272 T-GM Compliant IEEE 1588v2 SynE, onboard GPS

NVIDIA L4

• Intel® Xeon D-2100 8/12/14/16 Cores Processor
• Short Depth Chassis and Wide Operating Temperature -40~65ºC
• 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
• Front Access I/O with 1x GbE RJ45 for IPMI, 8x 10G SFP+, 1x RJ45 Console, 1x USB 3.0 and Screw-less Fan Replacement
• 4x 2.5” Internal HDD/SSD Bays, 1x M.2 NVMe 2280 M key
• 1x PCI-E x16 slot for FPGA or GPU cards (Max. up to 75W)
• Intel® QuickAssist Technology

• Intel® Atom™ X6000 Series Processor (codename: Elkhart Lake-I)
• 1x SODIMM DDR4, Up to 32GB
• eMMC 128GB, 1x SATA
• 1x PGN Series Removable Caddy, 1x M.2 304(5)2 B Key socket (USB 3.0/PCIe x1) for 4G LTE/ 5G sub6, 1x M.2 2230 E key socket for Wi-Fi
• 7x RJ45 ports (2x GbE LAN w/I210IT, 4x PoE+w/1x i210IS, 1x OOB (by SKU)
• 3x USB 2.0, 1x USB 3.0, 2x HDMI, 1x TPM 2.0

• NVIDIA® Jetson Orin NX/Nano Processors
• LPDDR5 Memory Up to 16/8/4GB
• 1x GbE RJ45, 2x GbE RJ45 with PoE+
• 2x COM(optional 1x CAN), 2x USB 3.2, 1x HDMI, 4x GMSL2 Video-in
• GPS & G-sensor
• 1x M.2 2230 E-Key for WiFi, 1x M.2 3042/3052 B-Key for LTE/5G, 2x Nano-SIM for LTE/5G module
• Wide range of operating temperature -40~70ºC

• 13th Generation Intel® Core™ Processor (Raptor Lake-P)
• Certified with EN50155 and EN45545 Standard
• NVIDIA MXM GPU Module Support
• 2x 2.5GbE PoE+ LAN, 4x 2.5GbE LAN, 1x USB 2.0, 2x USB 3.2, 2x HDMI, 1x Console, 1x OOB for RJ45
• Support 4x Removable PGN Series Caddies for 5G/LTE connectivity
• 1x Removable 2.5” drive bay