Wide Temperature Network Appliances
- Intel Atom Denverton
- Wide Temp.-40~70ºC
- 4x RJ45, 2x SFP
NEW
Wide Temperature Network Appliance Powered by Intel® Atom® C3000 (Denverton)
- Intel® Atom® 2~8 Cores C3308/C3508/C3708 CPU (Denverton)
- 4x RJ45, 2x SFP or 2x RJ45 (By SKU), 1 Pair of Gen3 Bypass
- Wide Operating Temperature range: -40~70ºC (SKU C to 60ºC)
- SKU D/E/F: 1x Optional removable M.2 LTE Caddy
- Intel® QuickAssist Technology up to 10Gbps
- 1x Mini USB Console, 2x USB 3.0 (SKU B/C), 1x 2.5” HDD/SSD Bay (Optional)
- Optional Rack Mounting kit Support
Wide Temperature Network Appliances
- Intel® Atom™ CPU
- 5x RJ45, 2x USB
- 2x COM
IEC 61850-3 Wide Temperature ICS Cyber Security Gateway with Intel Atom CPU
- Wide Temperature ICS Cyber Security Box PC
- IEC 61850-3, IEEE 1613 and C1D2 Certified
- Intel® Atom™ x7-E3950 or x5-E3930 CPU
- 5 x GbE LAN with 1 pair bypass, 2 x GbE SFP
- Onboard TPM support
- HDMI display output
- Mini-PCIe with SIM card slot for 4G-LTE support
- 2 x USB 3.0 and 2 x Isolated RS232
Wide Temperature Network Appliances
- Intel® Atom™ x6000E
- 2x RJ45, 2x HDMI
- 3x Optional 4G LTE
NEW
Rugged In-vehicle Gateway with Multi-WAN Connectivity
- Intel® Atom™ x6425RE Processor (codenamed Elkhart Lake)
- 1x DDR4 3200MT/s SODIMM slot up to 32GB with In Band ECC
- eMMC 64GB
- 3x PGN Series Removable Caddy, 1x M.2 3042 B key socket with dual nano-SIM slot for 4G LTE, 1x M.2 2230 E key socket for Wi-F
- 2x GbE Ethernet, 3x USB 2.0, 1x USB 3.0, 2x HDMI, 1x TPM 2.0 2x RS232/422/485, 1x CAN 2.0, 4x DIO isolation
- Operating temperature: -40°C~70°C
- 2x HDMI
- GPS+GLONASS dual band, G-sensor
- CE/FCC Class A, E13, MIL-STD-810G anti-vibration & shock
Wide Temperature Network Appliances
- Intel Atom Denverton
- 5G & Wi-Fi 6 Ready
- IP67 & Wide Temp.
NEW
IP67 Rugged 5G Edge Network Appliance
- Fanless Design Compliant with IP67 and MIL-STD-810G
- Intel® Atom® C3000 Extended Temperature CPU (Denverton)
- 2x DDR4 up to 2133 MHz ECC SODIMM Slots, Default 16GB x1
- M12 I/O: SR-IOV for 4x LAN, 2x PoE+(By SKU), 1x USB, 1x Console
- Wide Operating Temperature: -40~70ºC or -40~60ºC (By SKU)
- 1x M.2 Socket for 5G, 1x M.2 socket for Wi-Fi 6, 1x Mini-SIM
- Intel® QuickAssist Technology
- On-board eMMC 128GB, 1x M.2 2242 B Key, TPM 2.0
Wide Temperature Network Appliances
- Intel® Sapphire Rappids EE
- OCP 3.0 NIC, TPM
- 3x PCIe Slots
NEW
5G Edge Server with Intel® Xeon®Scalable Processor (Sapphire Rapids SP/EE)
- Intel® Sapphire Rapids SP/EE Processor
- Intel vRAN Boost Support (Sapphire Rapids SP/EE)
- Short Depth Chassis and Front I/O Design
- 16x DDR5 4400MHz RDIMM, Max. 1024GB
- 1x OCP 3.0 NIC Module
- 0 ~ 50ºC Operating Temperature (By CPU SKU)
- 2x M.2 NVMe 2280, 2x 2.5’’ SATA/ U.2
- 1x FHFL PCIex 16 slot, 2xLP or 1xFHHL slot (PCIex8)
- Secure BMC / TPM 2.0
- A NVIDIA-Certified System for industrial edge
Wide Temperature Network Appliances
- Intel® Xeon D-2700
- 10G SFP+, 25G SFP28
- -40~65ºC Temp. Range
NEW
High Performance Edge Computing Appliance With Intel Xeon® D-2700 Multi-core Processor
- Intel® Xeon D-2700 8~20 Cores Processor
- 4x DDR4 3200MHz REG RDIMM, Max. 256GB
- 8x 10G SFP+, 2x 25G SFP28, 1x RJ45, 2x USB 3.0
- 1x RJ45 Console, 2x M.2 NVMe 2280, 1x PCIe*16 FH 3/4L, 1x OCP 3.0 Slot
- -40C~65C Operating Temperature (SKU B)
- Intel® QuickAssist Technology
Wide Temperature Network Appliances
- Intel® Xeon D-2100
- Short Depth Chassis
- Wide Temperature
NEW
Short Depth Chassis Edge Computing Appliance with Intel Xeon® D-2100 Multi-core Processor (Codenamed Skylake-DE)
- Intel® Xeon D-2100 12/16 Cores Processor
- Wide Operating Temperature -40~65ºC
- 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
- Front Access I/O: 1x GbE RJ45 IPMI, 8x 10G SFP+, 2x 40G QSFP+, 1x RJ45 Console, 1x USB 3.0 and Front Fan Replacement
- 2x 2.5” Internal HDD/SSD Bays, 2x M.2 NVMe 2280 M key
- 1x PCI-E*16 FH/HL slot for FPGA or GPU cards
- Optional G.8272 T-GM Compliant IEEE 1588v2 SynE, onboard GPS
Wide Temperature Network Appliances
- Intel® Xeon D-2100
- Short Depth Chassis
- Wide Temperature
NEW
1U 19” Rackmount Open RAN Appliance with Intel Xeon® D-2100 Multi-core Processor (Codenamed Skylake-DE)
- Intel® Xeon D-2100 8/12/14/16 Cores Processor
- Short Depth Chassis and Wide Operating Temperature -40~65ºC
- 2x DDR4 2667 MHz REG, ECC RDIMM, Max. 64GB
- Front Access I/O with 1x GbE RJ45 for IPMI, 8x 10G SFP+, 1x RJ45 Console, 1x USB 3.0 and Screw-less Fan Replacement
- 4x 2.5” Internal HDD/SSD Bays, 1x M.2 NVMe 2280 M key
- 1x PCI-E x16 slot for FPGA or GPU cards (Max. up to 75W)
- Intel® QuickAssist Technology