Product details
- Intel Ice Lake CPU
- Double-Width FH3/4L PCIe
- Support OCP NIC 3.0
NEW
2U Compute Sled for HTCA-E400
- Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
- Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
- Support FH3/4L double width or single width PCIe Card
- Support OCP NIC 3.0 Modules
- Compatible with HTCA-E400 Series
Overview
The HMB-E200 compute sled is powered by 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake), and provides front access I/O including storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port, LOM and USB 3.0 ports. The FHHL PCIe by 16 slots can support a GPU or FPGA card, in addition to an OCP NIC slot to plug in OCP 3.0 NIC modules. This compute sled is compatible with HTCA-E400 Series network appliances.
Specifications
| Model | |
| HMB-E200A | |
| Processor | |
| 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake) |
|
| Memory | |
| DDR4 DIMM x8, LRDIMM+ECC Max capacity Dependent on CPU |
|
| Front Panel Interface | |
| Storage bays x4, PCIe slot x2, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports |
|
| System Compatibility | |
| HTCA-E400 Series | |
| Temperature | |
| Operating | 0~40ºC |
| Storage | -40~70ºC |
| Humidity | |
| 5%~90% RH, Non-condensing | |
| Mechanical | |
| Dimension (W x H x D) | 216.5 x 85 x 490.2 mm |
| Weight | TBD |
| Certification | |
| CE | Class A |
| FCC | Class A |
Order Information
| HMB-E200A | 2U Compute Sled for HTCA-E400 |
All product specifications are subject to change without prior notice