Today sees the release of Lanner Electronics’ LEC-7070, a compact, fanless, dust-proof and high-performance industrial PC powered by Intel's 3rd generation Core™ processors.

Whereas the previous version of the LEC-7070 was built with Intel’s Sandy Bridge microarchitecture, this upgraded and more powerful version of the LEC-7070 is designed with Intel’s Ivy Bridge microarchitecture, namely the Intel® Core™ i7/i3 processor and the Intel® HM65 chipset, offering dual-core, quad-thread performance and taking advantage of Intel’s Hyper-Threading and Turbo Boost Technologies.

In addition to powerful CPUs, the LEC-7070 features dual GbE LAN ports, dual serial COM ports, four USB ports, dual DIO with +5V TTL and two mini-PICe, one of which is a full-sized socket with SIM card reader.

What’s more, the LEC-7070’s video-out ports support up to 2048 by 1536 resolution via VGA and up to 1920 by 1080 resolution via HDMI. Such high resolution is coupled with up to 4 GB of DDR3 system memory, making seamless display of high definition video, required by applications such as machine vision and digital signage, a possibility.


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Last but not least, the LEC-7070’s fanless and dustproof design, industrial-grade operating temperature (from -20℃ ~ to 50℃) and aluminum encasing not only extend its life span, but also allowing for deployment in a variety of factory and production settings.

This combination of powerful CPUs, rich I/O interface such as the dual GbE LAN ports, multiple video-out ports and wide operating temperature range all make the LEC-7070 an especially ideal solution for machine vision applications that require image-capturing and multi-camera vision for conducting precise and repetitive verification and testing in high speed.

All in all, the LEC-7070 strikes a perfect balance between performance and cost, offering processing power, industrial-grade functions and network communications capabilities in a compact form factor.