Lanner's High-Variety Manufacturing Facility represents a pioneering approach to modern manufacturing, where adaptability and diversity take center stage. Nestled in the heart of innovation, Lanner's facility stands as a testament to the ever-evolving landscape of production, catering to a broad spectrum of products with precision and efficiency. With a commitment to high-variety, low-volume manufacturing, Lanner has redefined the traditional factory model, making customization, flexibility, and quality the cornerstones of its operation.
The videos below provide a glimpse into the world of Lanner's High-Variety Manufacturing Facility, showcasing all-new automated equipment for improved flexibility, traceability, and production efficiency.
Lanner owns and operates its own in-house state-of-the-art SMT, DIP, assembly, and testing facilities. By maintaining control of the entire manufacturing process, we ensure the integrity of your end product through our stringent production procedures, integrated quality assurance programs, and rigorous design quality.
Smart Shelf
Here is a smart kitting solution for SMT kitting. Moreover, Systematic real-time component control also improves reel quantity management. IC Programmer
This automatic IC programmer will pick up, place, program, take out, and pack up chips for an IC programming system. SPI
Here is the 3D SPI machine. Solder Paste Storage
The SMT quality control process begins with a storage temperature control that is set below 10ºC. SMT Mounter
There are 18 high-speed mounters and two multiple mounters among the SMT mounting machines. Solder Printer
The solder printer is responsible for applying solder paste to the circuit board. Reflow Oven
With a minimum of 6 points, the profile board will be used for reflow temp testing. We may add more test points if the customer requests it. AOI
This 3D AOI machine inspects everything. 3D Xray and 3D Scope
Each work order receives a sampling check to screen out weak solder junctions. Stencil Cleaner
The new stencil cleaner can not only clean stencils but also clean PCBs based on the needs of the customer. It can clean up to 25 PCBs at one time. Stencil Surface Strength Measurement
We clean the stencil and measure the surface strength (9 points) before production. T1 T2 T3 Test Station
Lanner's TestBed test program is being used to do full function testing. DIP Insert
Real time ESD control system" that displays the ESD connection status of each seat on a monitor. DIP Oven
We have a wave solder oven as well as a selective solder oven. Burn in room
The burn in room now has three temperature levels: 40ºC, 50ºC, and 75ºC, with a real-time monitoring system from outside the burn in room. Packing
In order to prevent the omission or shortage of components, the contents of the accessory box are assessed through a weight measurement process. The finished goods weighing system then compares the real weight to the established system standard and documents the outcomes. System Test
The test station basically performs simple power on test for most standard models. Torque calibration
The electronic screwdriver's torque will undergo three system checks for calibration before production, and the calibrated values will be recorded in the system. FQC Final Quality Control
For quality control inspections, the Final Quality Control (FQC) department utilizes an AQL 0.65 sampling method. This involves capturing images of the First Article Inspection (FAI) units for inspection and recordkeeping purposes, conducting functional tests, and verifying the customer's operating system version. Assembly
Modularized assembly, such as a FAN module, LAN module, or power board, to save cycle time at the assembly station below.