Modules and Blades
- 2xQSFP28+16xSFP+4xRJ45
- Broadcom Trident-III
- For HTCA-6000 Series
Modules and Blades
- 14x QSFP28 Ports
- Intel Tofino Switch
- For HTCA-6600 Series
NEW
Open RAN Platforms
- 10/25/100GbE fiber
- Intel Tofino Switch
- Optional IEEE 1588
NEW
Modules and Blades
- Intel Atom E3800
- Max. 8GB Memory
- HLM1020 Compatible
Modules and Blades
- 2x Intel Xeon Cascade Lake
- Max. 512GB Memory
- 5x Hot Swappable Fans
Compute Blade for HTCA-6000 Series Powered by 2nd Generation Intel® Xeon® Scalable Processors
- Hot swappable x86 compute blade
- Support dual 2nd Generation Intel® Xeon® Scalable Processors (codenamed Skylake-SP/Cascade Lake) C621/C627 PCH
- 16x 288-pin DDR4 DIMMs, max. up to 512GB memory capacity
- 4x KR4 supporting 4x 100G to front Switch blades
- 5x Hot swappable smart fans
Modules and Blades
- 2x 4th Gen Intel Xeon CPU
- Max. 1024GB Memory
- Built-in Intel QAT
PRELIMINARY
PRELIMINARY
Compute Blade for HTCA-6000 Series Powered By The 4th Gen Intel® Xeon® Scalable Processors (Codenamed Sapphire Rapids)- Hot swappable x86 compute blade
- 4th Generation Intel® Xeon® Scalable Processors with Emmitsburg PCH
- DDR5 4800 MHz REG DIMM, 16x 288pin DIMM Socket, LRDIMM 1024GB (16 x 64GB) per M/B tray
- Built-in Intel QuickAssist Technology (QAT)
- 4x KR4 supporting 4x 100G to front Switch blades
- 5x Hot swappable smart fans
Open RAN Platforms
- Intel Ice Lake CPU
- 1x PCIe slot
- Support OCP NIC 3.0
NEW
Open RAN Platforms
- Intel Ice Lake CPU
- Double-Width FH3/4L PCIe
- Support OCP NIC 3.0
NEW
2U Compute Sled for HTCA-E400
- Support 3rd Gen Intel Xeon Scalable Processor (codenamed Ice lake)
- Front Access I/O: Storage bays x4, PCIe x1, OCP NIC slot x1, mini-DP port (VGA signal), LOM and USB 3.0 ports
- Support FH3/4L double width or single width PCIe Card
- Support OCP NIC 3.0 Modules
- Compatible with HTCA-E400 Series
HybridTCA Platforms
- 4x Intel Broadwell-EP CPUs
- 2x Switch or 2x Ethernet Blade
- NEBS compliant design
High Availability Chassis 2U Telecom Network Appliance with 2 x86 CPU Blades and 2 I/O Blades
- High availability, full redundancy and extreme high performance
- 2 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
- Blade 1~2: Switch fabric blade or ethernet I/O blade
- 2 x Swappable I/O blades in front, supporting up to 2 switch blades or Ethernet blade configuration
- Redundant power supply and removable fan module
- NEBS compliant design
HybridTCA Platforms
- 8x Intel Skylake SP CPUs
- 2x Switch, 1x Storage Blade
- NEBS compliant design
High Availability Chassis 4U Telecom Network Appliance with 4 x86 CPU Blades and 2x Switch blades for redundancy, Storage blades with 10x NVMe SSD or Network blades
- High availability, full redundancy and extreme high performance
- 4 compute blades in the rear, per blade supports up to dual Intel® Xeon® Scalable (Skylake-SP) CPUs and 16x DDR4 R-DIMM
- Upper 2 slots: 2x switch blades in upper two slots for redundancy or 2x Ethernet blades
- Bottom 2 slots: Storage blades with 10x NVMe SSD in bottom two slots or up to 2x Ethernet blades
- Max. up to 80 ports 10G SFP+ Ethernet ports (4x Ethernet blades)
- N+N Redundant power supply and removable fan module
- NEBS compliant design
HybridTCA Platforms
- 12x Intel Emerald Rapids CPU
- 2x Switch, 4x Ethernet Blades
- NEBS compliant design
High Availability Chassis 6U Telecom Network Appliance with 6 x86 CPU Blades and 6 I/O Blades
- High availability, full redundancy and extreme high performance
- 6 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
- 6 x Swappable I/O blades on the front, supporting up to 2x Switch blades or 6x Ethernet blades; 6x swappable 3.5” HDD bays
- Blade 1~2: Switch fabric blade or Blade 1~6: Ethernet I/O blade
- NEBS compliant design
- Redundant power supply and removable fan module
HybridTCA Platforms
- 4U Short-Chassis Edge Server
- 5x Intel Ice Lake CPU
- 2x Switch, 5x PCIe Slots
NEW
Carrier-grade Edge Server Chassis for Open RAN / MEC
- Carrier-grade, full redundancy and extreme high performance
- 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
- Support 5x 1U compute sleds or 2x 2U+1U compute sleds
- Support 2x 1U switch sleds for redundancy
- Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe by 16 card
- 450mm Short Depth Chassis for Edge Deployment
- Distinguished, Flexible and Front I/O Access
- 1+1 Redundant Hot-swappable PSU
- NEBS-3 Compliant for Harsh Conditions
Modules and Acceleration Cards
- IPMI 2.0 Compliant
- OPMA Interface
Modules and Acceleration Cards
- IPMI 2.0 Compliant
- OPMA Interface
Modules and Acceleration Cards
- Intel Xeon 6 SoC
- 2x 100G QSFP56