Lanner, a leading provider of network appliances and SD-WAN solutions, has announced its participation in the MPLS World Congress 2023, which will take place from April 18-20, 2023, in Paris, France, is expected to draw thousands of industry experts and executives to discuss the latest trends, innovations, and best practices in 5G edge computing technologies.

As a sponsor and an exhibitor at booth #H27, Lanner will showcase its latest network appliances, scalable edge servers, and whitebox uCPE designed to enable zero-trust SASE, SD-WAN, Open RAN and SRv6 segment routing.

Featured Products

Scalable Edge Server


Carrier-grade Edge Server Chassis for Open RAN / MEC

CPU Depending on compute sled
Chipset Depending on compute sled

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Open RAN Appliance


Short Depth Chassis Edge Computing Appliance with Intel Xeon® D-2100 Multi-core Processor (Codenamed Skylake-DE)

CPU Intel® Xeon® D2100 12/16 Cores
Chipset N/A

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SASE Appliance


1U 19” Rackmount Network Appliance With Intel Xeon® D-2700 Multi-core CPU (Codenamed Ice Lake D)

CPU Intel® Xeon® D2700 10~20 Cores
Chipset N/A

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Whitebox uCPE


Desktop Network Appliance Powered By Intel® Atom® C5325/C5315 (Parker Ridge) CPU

CPU Intel® Atom® C5325/C5315 (Parker Ridge)
Chipset SoC

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