HybridTCA Platforms
- 8x Intel Skylake SP CPUs
- 2x Switch, 1x Storage Blade
- NEBS compliant design
High Availability Chassis 4U Telecom Network Appliance with 4 x86 CPU Blades and 2x Switch blades for redundancy, Storage blades with 10x NVMe SSD or Network blades
- High availability, full redundancy and extreme high performance
- 4 compute blades in the rear, per blade supports up to dual Intel® Xeon® Scalable (Skylake-SP) CPUs and 16x DDR4 R-DIMM
- Upper 2 slots: 2x switch blades in upper two slots for redundancy or 2x Ethernet blades
- Bottom 2 slots: Storage blades with 10x NVMe SSD in bottom two slots or up to 2x Ethernet blades
- Max. up to 80 ports 10G SFP+ Ethernet ports (4x Ethernet blades)
- N+N Redundant power supply and removable fan module
- NEBS compliant design
HybridTCA Platforms
- 12x Intel Emerald Rapids CPU
- 2x Switch, 4x Ethernet Blades
- NEBS compliant design
High Availability Chassis 6U Telecom Network Appliance with 6 x86 CPU Blades and 6 I/O Blades
- High availability, full redundancy and extreme high performance
- 6 CPU blades in the rear, per blade supports up to 2 Intel® Xeon® Processor Scalable Family CPUs and 16x DDR4 R-DIMM
- 6 x Swappable I/O blades on the front, supporting up to 2x Switch blades or 6x Ethernet blades; 6x swappable 3.5” HDD bays
- Blade 1~2: Switch fabric blade or Blade 1~6: Ethernet I/O blade
- NEBS compliant design
- Redundant power supply and removable fan module
HybridTCA Platforms
- 4U Short-Chassis Edge Server
- 5x Intel Ice Lake CPU
- 2x Switch, 5x PCIe Slots
NEW
Carrier-grade Edge Server Chassis for Open RAN / MEC
- Carrier-grade, full redundancy and extreme high performance
- 3rd Generation Intel® Xeon® Scalable Processor with AI Acceleration
- Support 5x 1U compute sleds or 2x 2U+1U compute sleds
- Support 2x 1U switch sleds for redundancy
- Support OCP NIC 3.0 Modules: 2U: Support FH3/4L double width PCIe Card, 1U: Support FHHL PCIe by 16 card
- 450mm Short Depth Chassis for Edge Deployment
- Distinguished, Flexible and Front I/O Access
- 1+1 Redundant Hot-swappable PSU
- NEBS-3 Compliant for Harsh Conditions
Modules and Acceleration Cards
- IPMI 2.0 Compliant
- OPMA Interface
Wide Temperature Network Appliances
- Intel Atom x7-E3950/x5-E3940
- Front access RJ45, SFP, DIO
- 2x SIM, 1x DP, 2x M.2
NEW
Industrial-Grade Cyber Security Appliance with Intel® Atom™ E3900 Processor
- Industrial Grade Cyber Security Platform
- Intel® Atom™ x7-E3950/x5-E3940 (Apollo Lake)
- 8x, 6x or 4x GbE RJ45 ports with 1 or 2 pairs Bypass, SKU C,D,F with 2x GbE SFP
- 2x USB 3.0, 1x DB9 console, 2x DIO, 64GB eMMC onboard
- 1x M.2 B-Key for LTE/5G sub6 with dual SIM, 1x M.2 E-Key for WiFi
- Onboard TPM 2.0
vCPE/uCPE Platforms
- Intel® Atom™ X6000E CPU
- 6x 2.5 GbE RJ45 + 2x SFP
- Optional LTE/Wi-Fi/5G-sub6
NEW
IEC 61850-3 Wide Temperature Industrial Cybersecurity Gateway
- IEC 61850-3 and IEEE 1613 Certified
- Certified with IP30 rating for enhanced durability
- Intel® Atom™ X6211E/X6413E/X6425E CPU (Elkhart Lake)
- 6x 100M/1G/2.5 GbE RJ45 with 1 pair bypass, 2x GbE SFP, TPM 2.0, 1x COM, 2x USB, 2x DIO
- Chassis Intrusion Detection, TPM 2.0, Optional IPMI support
- 1x M.2 B-Key For LTE/5G, 1x M.2 E-Key for Wi-Fi module
- Dual +12~48Vdc Power Input, Operating Temperature -40~70ºC
Wide Temperature Network Appliances
- AMD Ryzen V1404I CPU
- 6x or 4x GbE RJ45 + 2x SFP
- Optional LTE support
NEW
IEC 61850-3 Wide Temperature Industrial Cybersecurity Gateway
- IEC 61850-3 & IEEE 1613 certified
- AMD Ryzen V1404I
- 6x GbE RJ45 or 4x GbE RJ45 + 2x GbE SFP (1 pair LAN bypass by RJ45)
- 1x RJ45 Console, 1x USB 3.0, 2x DIO
- 1x M.2 3042 B-Key for LTE module with dual Nano-SIM
- Dual +12~48VDC Power Input
- Wide Operating Temperature -40~70ºC
Wide Temperature Network Appliances
- Intel Atom x7-E3950
- M-12 LAN and HDMI ports
- 2x M.2, 4x SIM slots
NEW
Fanless Rolling Stock Computer with Intel® Atom™ x7-E3950 Processor
- Intel® Atom™ x7-E3950 Processor
- Certified with EN50155, EN50121, EN50125 and EN45545
- Vehicle/Rail Computer with 6x M12 GbE ports
- 2x M.2 Slots with up to 4x SIM card readers
- Wide range operating temperature from -40 to 70°C
- 2x HDMI and 4x USB ports
- 1x Internal HDD/SSD drive bay
- Support 24~36V or 72~110V power input
Industrial GbE PCIe Cards
- HSR/PRP
- IEEE 1588
NEW
Embedded Platform
- Intel® Apollo Lake
- 3x LAN, 2x COM
- 2x DP, 4x DIO
NEW
Industrial Environment Gateway IPC With Intel® Apollo Lake CPU
- Intel® Apollo Lake CPU
- 3x or 2x GbE LAN, 2x RS232/422/485 COM
- 2x USB 3.0 & 2x USB 2.0, 2x Display Ports, 4x DIO
- 1x M.2 3042 B Key For LTE w/ Dual SIM, 1x M.2 2230 E Key For WiFi
- 1x mSATA, 1x 2.5” SATA Drive Bay (Optional)
- 1x DDR3L SODIMM, Max. 8GB
DIN-Rail Industrial Gateway
- Intel® Atom™ X7-E3950
- 4x RJ45 or 2x RJ45+2x SFP
- 2x COM, 2x CAN, 2x M.2
NEW
Robust DIN-rail Fanless Industrial Gateway with LTE/Wi-Fi 6 Connectivity Support
- Intel® Atom™ X7-E3950 / N3350 SoC CPU (formerly Apollo Lake)
- 2x COM, 2x CAN 2.0 (optional for 2x COM), 4x DI/DO, 2x USB 3.0, 1x DB9 console, DP, SKU A/M/O: 4x GbE RJ45 (one pair Bypass), SKU B/N/P: 2x GbE RJ45 (one pair Bypass) & 2x SFP, SKU Q: 4x GbE RJ45
- Onboard eMMC 64GB, DDR3L 4GB pre-install, 1x mSATA, optional 1x internal SATA 2.5” drive bay, TPM 2.0
- 1x M.2 B-Key w/ Nano SIM For LTE, 1x M.2 E-Key For Wi-Fi 5/6
- Wide operating temperature range: -40~70°C for industrial SKU A/B
Intelligent Video Platform
- 11th Gen Intel® Core i CPU
- 6x PoE+, 2x RJ45, 2x COM
- 2x HDMI, 8x DI, 4x DO
NEW
Computing Vision IPC w/ 11th Gen Intel® CoreTM i Series CPU (Codenamed Tiger Lake-UP3)
- 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 6x PoE+, 2x 2.5 Gbps RJ45, 2x COM Ports, 4x USB 3.0
- Intel® Iris® Xe Graphics, 2x HDMI, 8x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6
- 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD
Deep Learning Inference Appliances
- 11th Gen Intel® Core i CPU
- 1x M.2 B+M Key Hailo-8™
- PoE+, RJ45, COM, DIO
NEW
Computing Vision IPC w/ 11th Gen Intel® Core i Series CPU & Pre-installed M.2 B+M Key Hailo-8™ AI Accelerator
- 11th Gen Intel® Core™ i CPU (Up to i7-1185GRE)
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- Hailo-8™ M.2 Module Pre-installed
- 2x 2.5Gbps RJ45, 6x GbE RJ45 For PoE+
- 2x COM Ports, 4x USB 3.0, 2x HDMI, 8x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi-6, 1x M.2 M-Key For PCIe Gen4 x4 NVMe SSD
- Wide temperature range of -40°C~55°C
Intelligent Video Platform
- 11th Gen Intel® Core i
- PoE+, COM Ports
- Nano SIM (5G), M.2 (WiFi)
NEW
Computing Vision IPC With 11th Gen Intel® Core i Series CPU
- 11th Gen Intel® Core i CPU (Up to i7-1185GRE)
- 2x DDR4 3200 IBECC SO-DIMM, Max. 64GB
- 4x PoE+, 2x Ethernet Ports, 4x COM Ports (option for 2x CAN 2.0A/B), 4x USB 3.0
- Intel® Iris® Xe Graphics, 2x HDMI, 4x DI & 4x DO
- 1x M.2 B-Key w/ Nano SIM For 5G, 1x M.2 E-Key For WiFi, 1x mSATA
vCPE/uCPE Platforms
- Intel Atom Denverton
- 5G & Wi-Fi 6 Ready
- IP67 & Wide Temp.
IP67 Rugged 5G Edge Network Appliance
- Fanless Design Compliant with IP67 and MIL-STD-810G
- Intel® Atom® C3000 Extended Temperature CPU (Denverton)
- 2x DDR4 up to 2133 MHz ECC SODIMM Slots, Default 16GB x1
- M12 I/O: SR-IOV for 4x LAN, 2x PoE+(By SKU), 1x USB, 1x Console
- Wide Operating Temperature: -40~70ºC or -40~60ºC (By SKU)
- 1x M.2 Socket for 5G, 1x M.2 socket for Wi-Fi 6, 1x Mini-SIM
- Intel® QuickAssist Technology
- On-board eMMC 128GB, 1x M.2 2242 B Key, TPM 2.0
vCPE/uCPE Platforms
- Intel® Atom™ x6000E
- 2x RJ45, 2x HDMI
- 3x Optional 4G LTE
NEW
Rugged In-vehicle Gateway with Multi-WAN Connectivity
- Intel® Atom™ x6425E Processor (Elkhart Lake)
- 1x DDR4 3200MT/s SODIMM slot up to 32GB with In Band ECC
- 3x Removable PGN Series Caddy, 1x M.2 3042 B-Key socket with dual nano-SIM slot for 4G LTE, 1x M.2 2230 E-Key socket for WiFi
- 2x GbE RJ45, 3x USB 2.0, 1x USB 3.0, 2x HDMI, 1x TPM 2.0 2x RS232/422/485, 1x CAN 2.0, 4x DIO isolation
- eMMC 64GB up to 128GB storage, 1x SATA
- Operating temperature: -40~70ºC
Intelligent Video Platform
- Intel Celeron N3350
- 6x RJ45, 4x USB
- 1x Mini-PCIe
Optimized IoT-ready Solution for Machine Vision and Physical Security
- Intel® Celeron® N3350 or Atom™ x7-E3950
- 6x Ethernet Ports (LEC-2137A/LEC-2137C)
- 2x Ethernet Ports & 4x PoE Ports (LEC-2137B/LEC-2137D)
- 2x USB 3.0, 2x USB 2.0, 1x RS-232/422/485 DB9 Male
- -20°C~55°C Operating Temperatures (LEC-2137A/LEC-2137B)
- 1x HDMI (3840 x 2160), 1x VGA (1600 x 1200)
Embedded Platform
- Intel® Core™ i7/i5/i3
- 2x RJ45, 6x USB
- 2x Mini-PCIe
Fanless Embedded Computer with 3rd Gen Intel Core i7/i5/i3
- Intel® Core™ i7-3612QE/i7-3555LE/i5-3610ME/i3-3120ME
- Expandable PCI or PCIe slot
- Fanless design with corrugated aluminum
- Multiple display output (HDMI, VGA and DVI-D)
- Wide voltage input range (9~30VDC)
- Easily-opened chassis, no tools required
- Various mounting options
- Integrated SIM card reader
- Multi I/O expansion layer
- Remote power control
Embedded Platform
- Intel® Core™ i7/i5/i3
- 2x RJ45, 6x USB
- 1x Mini-PCIe
Embedded Platform
- Intel® Core™ i7/i5/i3
- 2x RJ45, 6x USB
- 2x Mini-PCIe
Embedded Platform
- Intel® Core™ i7 Processor
- 2x RJ45, 4x USB
- 1x Mini-PCIe
Intelligent Edge Computing Box PC w/ Support for Intel® Core™ i7-8700T/i7-8700/i7-9700TE and Intel® Xeon® E-2278GEL
- Intel® Core™ i7-8700T/i7-8700/i7-9700TE & Intel® Xeon® E-2278GEL
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- 1x PCIe*16, 1x PCIe*4, 1x Mini-PCIe w/ Nano-SIM, 1x B Key M.2 w/ Nano-SIM
Embedded Platform
- Intel® Core™ i7 Processor
- 4xPoE, 4xUSB, 6xCOM
- Intel® Movidius™ Myriad
Intelligent Edge AI Appliance With Intel® Core™ i7-9700TE
- Intel® Core™ i7-9700TE
- 2x DDR4 2133/2400 SO-DIMM, Max.64GB
- 2x GbE RJ45 & 4x GbE PoE
- 4x USB3.0, 6x COM, 8x DIO, Audio
- 1x Mini-PCIe (PCIe + USB2.0) w/ Nano-SIM, 1x PCIe*16 & 1x PCIe*4, 1x M.2 B-Key (PCIe + USB3.0) w/ Nano-SIM
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- Wide temperature range of 0°C~40°C
- TPM 2.0 & IPMI Support (By Request)
Deep Learning Inference Appliances
- Intel® Core™ i7 Processor
- 4xPoE, 4xUSB, 6xCOM
- NVIDIA® A2 GPU Support
Intelligent Edge Computing Box PC With NVIDIA® A2 GPU Compatibility
- Intel® Core™ i7 Processor (Coffee Lake)
- NVIDIA® A2 GPU Card Support
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 2x RJ45 GbE, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DIO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- 1x PCIe*16, 1x PCIe*4, 1x Mini-PCIe w/ Nano-SIM, 1x B-Key M.2 w/ Nano-SIM
- Built-in TPM 2.0 & IPMI (optional) Support
| NVIDIA A2 |
|---|
 |
Deep Learning Inference Appliances
- Intel® Core™ i7 Processor
- Falcon-H8 AI Card
- LAN, PoE, COM, DI/DO
NEW
Intelligent Edge Appliance With Falcon-H8 PCIe AI Accelerator Card
- Intel® Core™ i7 Processor (Coffee Lake)
- Falcon-H8 AI Accelerator Card With 6x Hailo-8™ AI Processors
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 2x GbE RJ45, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- 1x PCIe*16, 1x PCIe*4, 1x Mini-PCIe (PCIe + USB2.0) w/ Nano-SIM, 1x B Key M.2 (PCIe + USB3.0) w/ Nano-SIM
Deep Learning Inference Appliances
- Intel® Core™ i7 Processor
- 4xPoE, 4xUSB, 6xCOM
- NVIDIA® A2 GPU Support
Intelligent Edge Computing Box PC With NVIDIA® L4 GPU Compatibility
- Intel® Core™ i7 Processor (Coffee Lake)
- NVIDIA® L4 GPU Card Support
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 2x RJ45 GbE, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DIO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- 1x PCIe*16, 1x PCIe*4, 1x Mini-PCIe w/ Nano-SIM, 1x B-Key M.2 w/ Nano-SIM
- Built-in TPM 2.0 & IPMI (optional) Support
| NVIDIA L4 |
|---|
 |
AI Starter Kits
- Intel® Core™ i7 Processor
- 4xPoE, 4xUSB, 6xCOM
- Built-in SiMa.ai’s MLSoC™
Edge AI Appliance With the Built-in SiMa.ai’s MLSoC™
- Intel® Core™ i7 Processor (Coffee Lake)
- Built-in SiMa.ai’s MLSoC™
- 2x DDR4 2133/2400 SO-DIMM, Max. 64GB
- 2x RJ45 GbE LAN, 4x PoE, 4x USB3.0, 6x COM Ports, 8x DI & 8x DO
- 2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
- Built-in TPM 2.0 & Optional IPMI Support
Embedded Platform
- Intel® Celeron® J1900
- 2x RJ45, 5x USB
- 1x Mini-PCIe
Intelligent Video Platform
- Intel® Core™ i7/i5/i3
- 6x RJ45, 6x USB
- 2x Mini-PCIe
High-performance IPC with Intel® 6th Gen Skylake Core™ i7/i5/i3 CPU
- Intel® Core™ i7-6600U/i5-6300U/i3-6100U
- Intel® HD Graphics
- 2x HDMI, 3840 x 2160@24Hz or 2560 x 1600@60Hz
- 6x RJ45 (LEC-2580) or 2x RJ45 & 4x PoE (LEC-2580P)
- 4x USB 3.0, 2x USB 2.0
- 2x 2.5” HDD/SSD with RAID 0/1, 4x Serial Ports
- Operating Temperatures: 0°C~60°C (LEC-2580), 0°C~50°C (LEC-2580P)
DIN-Rail Industrial Gateway
- Intel Celeron N2807 CPU
- 2x RJ45, 2x USB
- 4x DI/O
Compact Industrial Grade DIN Rail Box PC with Intel® N2807/E3815 Processor
- Compact-sized industrial grade box PC
- Dual-core Intel Celeron N2807 SoC CPU or Single-core Atom E3815
- ESD/surge protection on serial COM ports for harsh environments
- Wide operating temperature (LEC-3030T:-40~70°C)
- Fanless design with corrugated aluminum
- Support VGA display output
- DIN-Rail or wall mounting options
- Support 4x DI/O
- Dual GbE LAN ports, 1 x USB 2.0, 1 x USB 3.0 port
- 1 x SATA port
DIN-Rail Industrial Gateway
- Intel® Atom E3825 CPU
- 4x RJ45, 2x USB
- 4/6/8/10x COM by SKU
Wide Temperature DIN Rail Box PC with 4G LTE Connectivity Support
- Wide operating temperature range (-40~70°C)
- Intel® Atom™ E3825 SoC CPU
- Front access I/O ports: LEC-3031-A4/6/8: 4/6/8 x RS-232/422/485, LEC-3031-I4/10: 4 or 10 x isolated COM ports
- 2 or 4 x Isolated GbE LAN / 4 x USB:1x USB 3.0, 1x or 3x USB 2.0, VGA port
- 1 x M.2 3042 (USB2.0 signal) for 4G LTE Wireless Expansion
- Fanless and compact design
Rackmount Industrial Computer
- Intel Xeon W-11000 Series
- 4x 2.5G RJ45, 5x USB
- 4x COM, 4x PCIe Slots
NEW
IEC 61850-3 Compliant 3U Rackmount Controller System for Power Substation
- IEC 61850-3 and IEEE 1613 Certified
- Support Intel® Xeon® W-11000 series CPU (Tiger Lake H)
- Support 2x SO-DIMM DDR4 ECC memory up to 64GB
- 4x 2.5GbE RJ45, 1x PCIe x16, 3x PCIe x4
- 5x USB, 2x HDMI, 2x isolated COM ports
- 2x 2.5”swappable drive bays
- Support dual power input
- Wide temperature range -40°C~70°C
| LEK-IS401 | LEK-IG401 |
|---|---|
 |
 |
DIN-Rail Industrial Gateway
- Intel® Atom™ E3845 CPU
- 5x RJ45, 2x USB
- 1x COM
Industrial cyber security PC with Intel Atom E3845 CPU and advanced LAN bypass
- Fanless and compact design
- Intel® Atom™ E3845 1.91GHz SoC CPU
- Wide Temperature Support: -40~70ºC
- With 2 x GbE SFP Fiber
- ESD/surge protection on serial COM ports for harsh environments
- 5 x GbE LAN with 1 pair Gen.3 LAN bypass
- DIN rail or wall mounting options
- 1 x USB 3.0 and 1x USB 2.0 port plus internal USB pin-header
Intelligent Video Platform
- Intel® Atom™ E3845
- 6x RJ45, 2x USB
- One Pair Gen.3 LAN Bypass
Industrial Grade PoE Network Appliance with Intel® Atom™ E3845 Processor
- Fanless industrial grade PoE network appliance
- Intel® Atom™ E3845 1.91GHz SoC CPU
- Wide operating temperature from -20 ºC to 55ºC
- Flexible LAN: 2x GbE + 4 x PoE (IEEE 802.3af)
- 1.5 KV magnetic isolation protection on LAN ports
- One pair Gen.3 LAN bypass
- 1x USB 2.0, 1x USB 3.0
- Support DIN rail and wall mount
vCPE/uCPE Platforms
- Intel Atom x7-E3950/x5-E3930
- 5x RJ45+2 x SFP
- 2x USB, 2x COM
IEC 61850-3 Wide Temperature ICS Cyber Security Gateway with Intel Atom CPU
- Wide Temperature ICS Cyber Security Box PC
- IEC 61850-3, IEEE 1613 and C1D2 Certified
- Intel® Atom™ x7-E3950 or x5-E3930 CPU
- 5 x GbE LAN with 1 pair bypass, 2 x GbE SFP
- Onboard TPM support
- HDMI display output
- Mini-PCIe with SIM card slot for 4G-LTE support
- 2 x USB 3.0 and 2 x Isolated RS232
Embedded Platform
- Intel® Celeron®, Atom™
- 2x RJ-45, 3x USB
- 1x Mini-PCIe
Small Form Factor Digital Signage PC with Intel® Bay Trail CPU
- Small form factor
- Low power consumption dual-core and quad-core Bay Trail SoC
- Support Intel Atom E3825/E3845 or Celeron J1900/N2930 CPU
- Rich I/O: VGA, HDMI, USB 3.0, 2xLANs, 2COMs, Audio
- Low-power DDR3L Memory support up to 8GB (J11A, N11A, E51A) or 4GB (E21A)
- Intel i210AT LAN controller
- Fanless Design
- Easily opened chassis with No tool required
- Screwed power lock
- Dust proof
Embedded Platform
- Intel® Celeron® J1900
- 2x RJ45, 3x USB
- 1x Mini-PCIe
Embedded Platform
- Intel® Celeron® J1900
- 2x RJ45, 3x USB
- 1x Mini-PCIe
Embedded Platform
- Intel® Celeron® N2807
- 3x RJ45, 3x USB
- 2x Mini-PCIe
SFF MES Thin Client Gateway with Intel® Celeron® N2807 SoC and Rich I/O
- Intel® Celeron® N2807 CPU
- Intel® HD Graphics
- 3x GbE Ethernet Ports, 1x USB3.0 and 2x USB2.0 Ports
- 1x HDMI with 1920 x 1080 Resolution
- 1x mSATA, 2x RS-232/485 Serial Ports
- 4x DI and 4x DO
- 1x Full-sized Mini-PCIe Slot with SIM Slot for 3G/LTE Communication
- 1x Half-sized Mini-PCIe Slot for Wireless Communication
Embedded Platform
- Intel® Apollo Lake
- 2x RJ45, 2x USB
- 1x Mini-PCIe
Industrial wireless gateway with Intel® Apollo Lake CPU and FCC/CE/PTCRB certification for LTE or Wifi.
- Intel® Apollo Lake CPU
- Onboard LPDDR4 Up to 8GB
- 2x GbE RJ45, 1x RS232/422/485 COM Port
- 2x USB 3.0, 1x Display Port, 1x HDMI
- 1x M.2 3042 B+M Key Socket w/ Dual SIM
- 1x Mini-PCIe Socket w/ Dual SIM
- Onboard LPDDR4, Up to 8GB
- 1x SATA 2.5" Drive Bay
- TPM 2.0 Support
Deep Learning Inference Appliances
- Intel® Apollo Lake
- 2x RJ45, 2x USB, COM
- 1x M.2 B+M Key Hailo-8™
NEW
Industrial wireless gateway with Intel® Apollo Lake CPU and FCC/CE/PTCRB certification for LTE or Wifi.
- Intel® Celeron® J3455 (Apollo Lake)
- Hailo-8™ M.2 module pre-installed
- 2x GbE RJ45, 1x COM Port
- 2x USB 3.0, 1x Display Port, 1x HDMI
- 1x M.2 3042 B+M Key Socket w/ Dual SIM
- 1x Mini-PCIe Socket w/ Dual SIM
- Onboard LPDDR4, Up To 8GB
- TPM Support
Intelligent Video Platform
- Intel Celeron N2930
- 2x RJ45, 3x USB
- 1x Mini-PCIe
Intelligent Video Platform
- Intel Celeron N2930
- 2x RJ45, 3x USB
- 1x Mini-PCIe
Fanless Surveillance Platform Powered by the Intel® Bay Trail CPU
- Intel® Celeron® J1900/N2930 or Atom™ E3845
- VGA (1600x1200) & HDMI (1920x1080) Video-out
- Fanless & Power-conscious
- Dual GbE Ports
- Dual Serial COM Ports
- High-speed USB 3.0
- Integrated SIM Card Reader
- J1900/N2930: 0°C~55°C ; E3845: -20°C~55°C
Industrial GbE PCIe Cards
- Intel i210IT
- 4x GbE RJ45 ports
NEW
Industrial GbE PCIe Cards
- Intel i210IS
- 4x GbE SFP ports
NEW
Modules and Acceleration Cards
- 8x LAN Ports
- 10KV Surge Protection
NEW
Vehicle Gateway
- Intel® Atom™ E3845
- 1x RJ45, 1x USB
- 2x Mini-PCIe
Fanless In-vehicle PC with MIL-STD-810G Certified Shock and Vibration Resistance
- Compact and fanless design
- MIL-STD-810G certified for shock & vibration resistance
- Quad-core Bay Trail Intel® Atom™ E3845 (1.91 GHz) CPU
- Wide range operating temperature from -20 to 60°C
- Wide voltage input range with ignition control
- 1 x LAN, 1 x USB 3.0, 2 x COM, 1 x optional CAN bus
- Video output ports, HDMI and VGA
- Mini-PCIe socket with SIM card reader
Vehicle Gateway
- Intel Atom E3845
- 2x RJ45, 2x USB
- 3 Mini-PCIe
Fanless Vehicle Gateway Controller with Intel Atom E3825 or E3845 Processor
- Power-efficient Intel® Atom™ E3825 or E3845 CPU
- 1 x DDR3L SODIMM up to 4 GB memory
- 2 x Intel® 10/100/1000 Mbps RJ-45 ports
- 3 x mini-PCIe sockets with total 4 external accessible SIM card reader, supporting Wi-Fi/3G/4G/LTE
- Compliant with MIL-STD-810G vibration/shock resistance
- Onboard GPS receiver module and G-sensor
- 1 x mSATA,1 x SATA 2.0 for 2.5" HDD storage
- Wide range operating temperature from -20 to 60°C
- 1 x USB 3.0 port and 1 x USB 2.0 port
- Optional CAN bus port
Wi-Fi Access Points
- Wi-Fi 6E Tri-Band AP
- Qualcomm Processor
- 4x4 MU-MIMO
NEW
High-Capacity Wi-Fi 6E Tri-Band Access Point
- Qualcomm® IPQ8076A Quad-Core@2.2GHz Processor
- Wi-Fi 6E Tri-Band Access Point
- 4x4 MU-MIMO in 2.4GHz, 5GHz and 6GHz
- Comply with IEEE 802.11a/b/g/n/ac/ax
- 12 Internal Antennas for optimal Wi-Fi performance
- BLE 5.1 for IoT management
- Multi-speed GbE WAN port (1/2.5/5/10GbE)
- IEEE802.3bt (PoE++)