HybridTCA Platforms

Lanner’s HybridTCA Platforms are created to meet the challenging requirements for carrier-grade network control, cloud computing and data center. These appliances integrate control, management and data processing in one system and have advantages over the prevalent AdvancedTCA infrastructure in aspects of hardware design, customization options and cost/energy efficiency.

HTCA-6600


High Availability Chassis 6U Telecom Network Appliance with 6 x86 CPU Blades and 6 I/O Blades

CPUIntel® Xeon® processor E5-2690 v3/v4 Series
ChipsetIntel C612 Chipset

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HTCA-6200


High Availability Chassis 2U Telecom Network Appliance with 2 x86 CPU Blades and 2 I/O Blades

CPUIntel® Xeon® processor E5-2690 v3/v4 Series
ChipsetIntel C612 Chipset

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HCP-72i2


High Availability Rackmount 2U Telecom Network Appliance with 2 x86 CPU Blades and 3 I/O Blades

CPU4 x Intel® Xeon® processor E5-2690 v3 series (Haswell-EP)
ChipsetIntel C612 Chipset

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HCP-72i1


HybridTCA™ Communication Platform with 2 x86 CPU Blades and 3 I/O Blades

CPU4x Intel® Xeon® processor E5-2600 v2 series on LGA2011 (Sandy Bridge-EP or Ivy Bridge-EP)
ChipsetIntel C604 Chipset

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Who We Are

Lanner Electronics Inc (TAIEX 6245) is a world leading provider of design, engineering and manufacturing services for advanced network appliances and rugged applied computing platforms for system integrator, service providers and application developers.

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Head Office

7F, 173 Datong Road Section 2,Xizhi District,New Taipei City 22184,Taiwan

Telephone: +886-2-8692-6060
Fax: +886-2-8692-6101
Email: contact@lannerinc.com

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