Fanless Embedded Computer with 3rd Gen Intel Core i7/i5/i3
- 3rd Gen Intel Core i7/i5/i3 processor
- Expandable PCI slots
- Fanless design with corrugated aluminum
- Multiple display output (HDMI, VGA and DVI-D)
- Wide voltage input range (9~30VDC)
- Easily-opened chassis, no tools required
- Various mounting options
- Integrated SIM card reader
- Multi I/O expansion layer
- Remote power control
LEC-2280 embedded computers use Intel® 3rd Generation Core® i3, i5, and i7 processors for excellent performance and rich expansion capability, and they are designed for wide deployment in application-specific environments, such as industrial automation and vision control. Also available is the high performance variant SKU-7B, with i7-3612QE quad-core processors, and the power efficient SKU-7A with the i7-3555LE CPU. Our fanless embedded systems emphasize stability and longevity, and deliver an extremely reliable solution for the most remote locations.
This product also provides a rich I/O interface with two GbE LAN ports, four serial COM ports and 4 USB ports for communications.
Intel Ivy Bridge Platform
The 22nm Ivy Bridge processors outperform its predecessor, Sandy Bridge, with a 5%~15% increase in CPU performance and 25%~68% increase in integrated GPU performance. Ivy Bridge processors use 3-D Tri-Gate transistor technology which consumes up to 50% less power than 2-D transistors at the same performance level. The customers wish to upgrade to Ivy Bridge will definitely see an increase in performance and a reduction in power consumption.
The lifespan of this IPC is extended with the removal of the most easily damaged component, the fan.
This platform comes with multiple video-out ports and can support separate video streams on dual displays.
Integrated SIM card reader
Integrated in one of the mini-PCIe slots, the SIM card reader, allows for users to enable 3G use for their IPC.
Expandable PCI slots
The product has additional space for 2 PCI expansion, allowing flexibility for whichever type of expansion per customers' needs and requirements.
Multi I/O Expansion Layer
LEC-2280 has an unique Multi I/O (MIO) Expansion Layer that makes it easier to get the I/O configuration you need. From the main board there is also an I/O connector that fits with a plug-in I/O card which you can customize by choosing from a selection of ports you need - Audio, DI/DO, Serial, USB, LAN and eSATA. There is also a drive bay area with SATA connectors for a 2.5” HDD or SSD. This connection can also be used to create an external CompactFlash socket.
|CPU||3rd Gen Intel® Core™ i7/i5/i3|
|Memory Technology||DDR3 SO-DIMM x2|
|Memory Capacity||Up to 16GB|
|SATA storage||2.5” SSD/HDD drive bay x1|
|Ethernet controller||Intel® 82574L x2|
|Graphic controller||Intel® HD Graphics 4000|
|Audio controller||Realtek ALC886|
|Default LAN||GbE RJ45 x2|
|Display output||HDMI x1 , DVI-D x1 , VGA x1|
|Audio ports||Phone Jack x2 for Mic-In and Line-Out|
|Serial ports||RS232/422/485 x2|
|USB 2.0||6 x Type A|
|Power and Mechanical|
|Expansion||Mini-PCIe x2: one with SIM card reader; PCI slot x2|
|Others||External: Power-on button, Power-on switch, reset|
|Reset||+9~30Vdc, ATX Mode|
|Hardware monitor||Fintek F81865 integrated watchdog timer 1~255 level|
|OS and Certifications|
|Operating System||Linux, Windows 7/7 Embedded/XP/XP Embedded|
|Certifications||CE, FCC Class A, RoHS|
|Physical and Environmental|
|-5oC to 45oC|
|Storage temperature||-10oC to 55oC|
|Dimensions (W x H x D)||276.39 mm x 88.46 mm x 193.5 mm (10.78" x 3.45" x 7.55")|
|Weight||3.3 kg (7.26 lbs)|
LEC-2280P2 Datasheet (release:2014-11-10)Download
LEC-2280P2 User Manual Download
LEC-2280P2 Windows7 Driver Download
LEC-2280P2 WindowsXP Driver Download
All product specifications are subject to change without prior notice