HLM-1030 Switch Blade with 100GbE Capability and Rich Networking I/O Sets

To establish a carrier-grade NFV infrastructure, the total integration of hardware and software is necessary in order to have a well-built virtual network environment for VNF deployments. Hardware wise, the platform shall accommodate high CPU core counts, high-throughput, carrier-grade reliability and scalability to be NFVi-ready.

To meet the specified requirements for the next-generation network, Lanner introduce its NFVi-ready, NEBS-certified modular platform HTCA-6200, offering high networking performance and up max. 100G high-speed switching capability. HTCA-6200 features dual CPU blades, dual swappable networking I/O blades, high-speed switch enabled and full-redundancy design. The dual CPU blades are empowered by dual Intel® Xeon® E5-2690 v3/v4 CPUs (24 cores per blade, a total of 48 cores across 2 blades) and 16x DDR4 R-DIMMs. In terms of switch capability, Lanner presents HLM-1030 switch blade with networking I/Os of 6x 100GbE QSFP28, 4x 40GbE QSFP+ and 16x 10GbE SFP+ cages, to go with HTCA-6200 for optimal performance.

Featured Products

HLM-1030


100 GbE Switch Blade with Broadcom StrataXGS Tomahawk BCM56960

CPUNone
ChipsetBroadcom StrataXGS Tomahawk BCM56960 3.2Tbps bandwidth Multilayer Switch Fabric

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HTCA-6200


High Availability Chassis 2U Telecom Network Appliance with 2 x86 CPU Blades and 2 I/O Blades

CPU Intel® Xeon® processor E5-2690 v3/v4 Series
ChipsetIntel C612 Chipset

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HTCA-6600


High Availability Chassis 6U Telecom Network Appliance with 6 x86 CPU Blades and 6 I/O Blades

CPUIntel® Xeon® processor E5-2690 v3/v4 Series
ChipsetIntel C612 Chipset

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Lanner Electronics Inc (TAIEX 6245) is a world leading provider of design, engineering and manufacturing services for advanced network appliances and rugged applied computing platforms for system integrator, service providers and application developers.

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